CCCI 2026

October 11-16, 2026, Shanghai, China

2026 International Conference on Communications, Computing, Cybersecurity, and Informatics

The 2026 International Conference on Communications, Computing, Cybersecurity, and Informatics, CCCI 2026, is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Communications, Computing, Cybersecurity, and Informatics (CCCI).

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Extended versions of selected accepted papers from the conference will be published in special issue(s)/Section(s) of International Journal of Communication Systems (SCI indexed) and Security and Privacy Journal (EI indexed).

PDF version of the Call for Participation

Summer Palace, Beijing (2019) by Antonio Bueno

At First Glance

Important Dates

Invited session, workshop, tutorial proposals: July 11, 2026
Paper submission: July 10, 2026
Author notification: September 11, 2026
Camera-ready paper Submission: October 1, 2026

Participation

All papers accepted in the conference will be reviewed by the international technical program committee.

Topics of Interest

Paper Submission

Papers should be written in English with a maximum paper length of 8 printed pages (10-point font, A4 size paper) including figures. For your submission you can use the standard IEEE Transactions templates for Microsoft Word or LaTeX formats (Remember: A4 size).

Papers must be submitted in Portable Document Format (PDF) format, using the following EDAS link:

NOT AVAILABLE YET

Important Notice

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (multiple submission).

Organizing Committee

General Chairs: Mohammad S. Obaidat, Univ. of Jordan, Jordan; Jingxiao Ma, Tongi Univ., China; Lin Zhang, Beihang Univ., China
Assistant General Chair: Yu Guo, Univ. of Science and Technology Beijing, China
Publication Chair: Xinyu (Amy) Zhang, Northwestern Polytechnic Univ., China
Assistant Publication Chair: Jing Zhang, Beijing Univ. of Posts and Telecommunications, China

Senior Program Chair: Petros Nicopolitidis, Aristotle Univ., Greece
Program Co-Chairs: Wang Lei, Beijing Information Science and Technology Univ., China; Imad Mahgoub, Florida Atlantic Univ., USA; Ruhul Amin, DSPM IIIT Naya Raipur, India
Tutorials and Special Sessions Chair: Sudeep Tanwar, Institute of Technology, Nirma Univ., India

Registration Chair: Yu Guo, Univ. of Science and Technology Beijing, China
Local Arrangement Committee: Shousheng Sun, Tongji Univ., China; Mingchen Ma, Tongji Univ., China; Jialing Hong, Tongji Univ., China

Publicity Committee: Nitin Gupta, National Institute of Technology, Hamirpur, India; Eirini Eleni Tsiropoulou, Arizona State Univ., USA; Xiaowei Tang, Tongji Univ., China; Yunmei Shi, Tongji Univ., China; Yi Huang, Tongju Univ., China; Chun Zhao, Beijing Information Science and Technology Univ., China; Fei Ye, Beijing Univ. of Chemical Technology, China; Yong Cui, Beihang Univ., China; Zhen Chen, Beihang Univ., China; Chao Chen, Chongqing Univ., China; Liangtian Wan, Dalian Univ. of Technology, China; Xiangjie Kong, Zhejiang Univ. of Technology, China; Lu Sun, Dalian Maritime Univ., China

International Liaisons: Balqies Sadoun, Al-Balqa' Applied Univ., Jordan; Yantao Yu, Shanghai Jiao Tong Univ., China; Xuewen Wu, Hangzhou Dianzi Univ., China; Peiran Dong, Hong Kong Polytechnic Univ., China; Yuxuan Yang, Sydney Univ., Australia; Handi Chen, Hong Kong Univ., China; Ning Wang, Rowan Univ., USA; Haozhe Wang, Univ. of Exeter, UK; Zheng Pan, Univ. of Canterbury, NZ; Chenxi Qiu, Univ. of North Texas, USA

Webmaster: Antonio Bueno, Univ. of Girona, Spain

Steering Committee

Pascal Lorenz: Univ. of Haute Alsace, France
Imad Mahgoub: Florida Atlantic Univ. USA
Mario Marchese: Univ. of Genoa, Italy
Mohammad S. Obaidat: Univ. of Jordan, Jordan (Chair)
Joel Rodrigues: Federal Univ. of Piaui, Brazil

George A. Tsihrintzis: Univ. of Piraeus, Greece
Laurence T. Yang: St. Francis Xavier Univ., Canada
Zhaolong Ning: Chongqing Univ. of Posts and Telecommunications, China
Albert Zomaya: Univ. of Sydney, Australia

Technical Program Committee

Ruhul Amin: IIIT Naya Raipur, India
Hamid R. Arabnia: Univ. of Georgia, USA
Hazrat Bilal: Univ. of Science and Technology of China, China
Franco R. Davoli: Univ. of Genoa & National Inter-University Consortium for Telecommunications (CNIT), Italy
Huiying Du: Beijing Information Science and Technology Univ., China
Stefano Giordano: Univ. of Pisa, Italy
Fabrizio Granelli: Univ. of Trento, Italy
Yu Guo: Univ. of Science and Technology Beijing, China
Helen Karatza: Aristotle Univ. of Thessaloniki, Greece
Georgios Keramidas: Aristotle Univ. of Thessaloniki & Think Silicon S.A., Greece
Stelios Krinidis: Democritus Univ. of Thrace (DUTH), Greece
Aparna Kumari: Nirma Univ., India
Fangyu Li: Beijing Univ. of Technology, China
Pascal Lorenz: Univ. of Haute Alsace, France
Imad Mahgoub: Florida Atlantic Univ., USA
Khalid Mahmood: National Yunlin Univ. of Science and Technology, Taiwan

Farid Nait-Abdesselam: Univ.é Paris Cité, France
Zichao Nie: Beijing Univ. of Aeronautics and Astronautics, China
Jun Peng: UTRGV - Edinburg, TX, USA
Muhammad Umar Farooq Qaisar: Hangzhou International Innovation Institute of Beihang Univ., China
Angel-Antonio San-Blas: Univ. of Elche, Spain
Aggeliki Sgora: Ionian Univ., Greece
Georgios L. Stavrinides: KIOS Research and Innovation Center of Excellence, Univ. of Cyprus, Cyprus
Eleftherios Tiakas: International Hellenic Univ., Greece
Eirini Eleni Tsiropoulou: Arizona State Univ., USA
Anastasios Valkanis: Aristotle Univ. of Thessaloniki, Greece
Lei Wang: Beijing Information Science and Technology Univ., China
Xiaofei Wang: Beihang Univ., China
Cong Wu: The Univ. of Hong Kong, Hong Kong
Heli Zhang: Beijing Univ. of Posts and Telecommunications, China
Xinyu Zhang: Northwestern Polytechnical Univ. & Monash Univ., China

Technical Sponsor

Important Dates

Participation

Paper Submission

Important Notice