CCCI 2024

October 16-18, 2024, Beijing, China (hybrid conference)

2024 International Conference on Communications, Computing, Cybersecurity, and Informatics

The 2024 International Conference on Communications, Computing, Cybersecurity, and Informatics, CCCI 2024, is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Communications, Computing, Cybersecurity, and Informatics (CCCI).

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Extended versions of selected accepted papers from the conference will be published in special issue(s)/Section(s) of International Journal of Communication Systems (SCI indexed) and Security and Privacy Journal (EI indexed).

PDF version of the Call for Participation

Technical Sponsor

Summer Palace, Beijing (2019) by Antonio Bueno

At First Glance

Important Dates

Invited session, workshop, tutorial proposals: July 12, 2024
Paper submission: July 12, 2024
Author notification: September 13, 2024
Camera-ready paper Submission: September 23, 2024

Participation

All papers accepted in the conference will be reviewed by the international technical program committee.

Topics of Interest

Paper Submission

Papers must be submitted in Portable Document Format (PDF) format, using the following EDAS link:

edas.info/N31827

Important Notice

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (multiple submission).

Organizing Committee

General Chairs: Mohammad S. Obaidat, The Univ. of Jordan, Jordan; Lin Zhang, Beihang Univ., China; Xiaokun Wang, Univ. of Science and Technology Beijing, China; Chao Yao, Univ. of Science and Technology Beijing, China
Assistant General Chair: Yu Guo, Univ. of Science and Technology Beijing, China

Senior Program Chair: Petros Nicopolitidis, Aristotle Univ., Greece
Program Co-Chairs: Yalan Zhang, Univ. of Science and Technology Beijing, China; Yuanjun Laili, Beihang Univ., China; Zhaolong Ning, Chongqing Univ. of Posts and Telecommunications, China; Yuanyan Xie, Tsinghua Univ., China; Chi Lin, Dalian Univ. of Technology, China; Imad Mahgoub, Florida Atlantic Univ., USA

International Liaisons: Balqies Sadoun, Al-Balqa' Applied Univ., Jordan; Peiran Dong, Hong Kong Polytechnic Univ., China; Yuxuan Yang, Sydney Univ., Australia; Handi Chen, Hong Kong Univ., China; Ning Wang, Rowan Univ., USA; Haozhe Wang, Univ. of Exeter, UK; Zheng Pan, Univ. of Canterbury, New Zealand; Chenxi Qiu, Univ. of North Texas, USA

Local Arrangement Chair: Lei Wang, Beijing Information Science and Technology Univ., China
Local Arrangement Committee: Feilong Du, Univ. of Science and Technology Beijing, China; Zhen Chen, Beihang Univ., China; Changtai Li, Univ. of Science and Technology Beijing, China; Yiran Tao, Beihang Univ., China; Hongjun Liu, Univ. of Science and Technology Beijing, China; Wenying Zong, Beihang Univ., China

Registration Chair: Kuei-Fang (Leila) Hsiao, Univ. of Texas, USA
Publication Chair: Yu Guo, Univ. of Science and Technology Beijing, China
Tutorials Chair: Sudeep Tanwar, Institute of Technology of Nirma Univ., India
Special Sessions Chair: Ling Yi, Beijing Univ. of Posts and Telecommunications, China

Publicity Committee: Nitin Gupta, NIT Hamirpur, India; Xiao Song, Beihang Univ., China; Hongbo Cheng, Beihang Univ., China; Yu Guo, Univ. Of Science and Technology Beijing, China; Yalan Zhang, Univ. Of Science and Technology Beijing, China; Yuexian Wang, Northwest Polytechnic Univ., China; Yin Zhang, Univ. of Electronic Science and Tech. of China, China; Fuliang Li, Northeastern Univ., China; Bin Wang, Dalian Univ., China; Tian Wang, Beijing Normal Univ., China; Ali Hassann Sodhro, Kristianstad Univ., Sweden; Pankaj Kumar, Central Univ. of Himachal Pradesh, India; Aparna Kumari, Nirma Univ., India

Webmaster: Antonio Bueno, Univ. of Girona, Spain

Steering Committee

Pascal Lorenz: Univ. of Haute Alsace, France
Imad Mahgoub: Florida Atlantic University USA
Mario Marchese: Univ. of Genoa, Italy
Mohammad S. Obaidat: Univ. of Jordan, Jordan (Chair)
Joel Rodrigues: Federal Univ. of Piaui, Brazil

George A. Tsihrintzis: Univ. of Piraeus, Greece
Laurence T. Yang: St. Francis Xavier Univ., Canada
Zhaolong Ning: Chongqing Univ. of Posts and Telecommunications, China
Albert Zomaya: Univ. of Sydney, Australia

Technical Program Committee (tentative)

Ruhul Amin: IIIT Naya Raipur, India
Hamid Arabnia: Univ. of Georgia, USA
Luca Caviglione: National Research Council (CNR), Italy
Franco Davoli: Univ. of Genoa, Italy
Stefano Giordano: Univ. of Pisa, Italy
Fabrizio Granelli: Univ. of Trento, Italy
Konstantinos Kantelis: Aristotle Univ. of Thessaloniki, Greece
Helen Karatza: Aristotle Univ. of Thessaloniki, Greece
Georgios Keramidas: Aristotle Univ. of Thessaloniki, Greece
Abdelmajid Khelil: Landshut Univ. of Applied Sciences, Germany
Stelios Krinidis: International Hellenic Univ. (IHU), Greece
Pankaj Kumar: Central Univ. of Himachal Pradesh, India
Aparna Kumari: Nirma Univ., India
Chi Lin: Dalian Univ. of Technology, China
Pascal Lorenz: Univ. of Haute Alsace, France

Farid Nait-Abdesselam: Univ. of Missouri Kansas City USA ,
Jun Pen: UTRGV - Edinburg, TX, USA
Joel Rodrigues: Senac Fac of Ceará, Brazil
Angel Antonio San-Blas: Univ. of Elche, Spain
Rashmi Priya Sharma: University of Missouri Columbia, USA
Ali Hassann Sodhro: Kristianstad Univ., Sweden
Georgios Stavrinides: KIOS CoE, Univ. of Cyprus, Cyprus
Eleftherios Tiakas: International Hellenic Univ., Greece
George Tsihrintzis: Univ. of Piraeus, Greece
Anastasios Valkanis: Aristotle Univ. of Thessaloniki, Greece
Gang Wang: MaxLinear Inc., USA
Yuexian Wang: Northwest Polytechnical Univ., China
Sherali Zeadally: Univ. of Kentucky, USA
Xinyu Zhang: Northwestern Polytechnical Univ., Xi'an, China