CCCI 2026

October 11-16, 2026, Shanghai, China

2026 International Conference on Communications, Computing, Cybersecurity, and Informatics

The 2026 International Conference on Communications, Computing, Cybersecurity, and Informatics, CCCI 2026, is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Communications, Computing, Cybersecurity, and Informatics (CCCI).

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Extended versions of selected accepted papers from the conference will be published in special issue(s)/Section(s) of International Journal of Communication Systems (SCI indexed) and Security and Privacy Journal (EI indexed).

PDF version of the Call for Participation

Summer Palace, Beijing (2019) by Antonio Bueno

At First Glance

Important Dates

Invited session, workshop, tutorial proposals: July 11, 2026
Paper submission: July 10, 2026
Author notification: September 11, 2026
Camera-ready paper Submission: October 1, 2026

Participation

All papers accepted in the conference will be reviewed by the international technical program committee.

Topics of Interest

Paper Submission

Papers should be written in English with a maximum paper length of 8 printed pages (10-point font, A4 size paper) including figures. For your submission you can use the standard IEEE Transactions templates for Microsoft Word or LaTeX formats (Remember: A4 size).

Papers must be submitted in Portable Document Format (PDF) format, using the following EDAS link:

NOT AVAILABLE YET

Important Notice

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (multiple submission).

Organizing Committee

General Chairs: Mohammad S. Obaidat, Univ. of Jordan, Jordan; Jingxiao Ma, Tongi Univ., China; Lin Zhang, Beihang Univ., China
Assistant General Chair: Yu Guo, Univ. of Science and Technology Beijing, China
Publication Chair: Xinyu (Amy) Zhang, Northwestern Polytechnic Univ., China
Assistant Publication Chair: Jing Zhang, Beijing Univ. of Posts and Telecommunications, China

Senior Program Chair: Petros Nicopolitidis, Aristotle Univ., Greece
Program Co-Chairs: Wang Lei, Beijing Information Science and Technology Univ., China; Imad Mahgoub, Florida Atlantic Univ., USA; Ruhul Amin, DSPM IIIT Naya Raipur, India
Tutorials and Special Sessions Chair: Sudeep Tanwar, Institute of Technology, Nirma Univ., India

Registration Chair: Yu Guo, Univ. of Science and Technology Beijing, China
Local Arrangement Committee: Shousheng Sun, Tongji Univ., China; Mingchen Ma, Tongji Univ., China; Jialing Hong, Tongji Univ., China

Publicity Committee: Nitin Gupta, National Institute of Technology, Hamirpur, India; Eirini Eleni Tsiropoulou, Arizona State Univ., USA; Xiaowei Tang, Tongji Univ., China; Yunmei Shi, Tongji Univ., China; Yi Huang, Tongju Univ., China; Chun Zhao, Beijing Information Science and Technology Univ., China; Fei Ye, Beijing Univ. of Chemical Technology, China; Yong Cui, Beihang Univ., China; Zhen Chen, Beihang Univ., China; Chao Chen, Chongqing Univ., China; Liangtian Wan, Dalian Univ. of Technology, China; Xiangjie Kong, Zhejiang Univ. of Technology, China; Lu Sun, Dalian Maritime Univ., China

International Liaisons: Balqies Sadoun, Al-Balqa' Applied Univ., Jordan; Yantao Yu, Shanghai Jiao Tong Univ., China; Xuewen Wu, Hangzhou Dianzi Univ., China; Peiran Dong, Hong Kong Polytechnic Univ., China; Yuxuan Yang, Sydney Univ., Australia; Handi Chen, Hong Kong Univ., China; Ning Wang, Rowan Univ., USA; Haozhe Wang, Univ. of Exeter, UK; Zheng Pan, Univ. of Canterbury, NZ; Chenxi Qiu, Univ. of North Texas, USA

Webmaster: Antonio Bueno, Univ. of Girona, Spain

Steering Committee

Pascal Lorenz: Univ. of Haute Alsace, France
Imad Mahgoub: Florida Atlantic Univ. USA
Mario Marchese: Univ. of Genoa, Italy
Mohammad S. Obaidat: Univ. of Jordan, Jordan (Chair)
Joel Rodrigues: Federal Univ. of Piaui, Brazil

George A. Tsihrintzis: Univ. of Piraeus, Greece
Laurence T. Yang: St. Francis Xavier Univ., Canada
Zhaolong Ning: Chongqing Univ. of Posts and Telecommunications, China
Albert Zomaya: Univ. of Sydney, Australia

Technical Program Committee (tentative)

Hamid R. Arabnia: Univ. of Georgia, USA
Jalel Ben-Othman: Univ. Sorbonne Paris Nord, France
Luca Caviglione: National Research Council (CNR), Italy
Franco R. Davoli: Univ. of Genoa, Italy
Stefano Giordano: Univ. of Pisa, Italy
Fabrizio Granelli: Univ. of Trento, Italy
Yu Guo: Univ. of Science and Technology Beijing, China
Hyunbum Kim: Incheon National Univ., South Korea
Helen Karatza: Aristotle Univ. of Thessaloniki, Greece
Georgios Keramidas: Aristotle Univ. of Thessaloniki, Greece
Abdelmajid Khelil: Landshut Univ. of Applied Sciences, Germany
Stelios Krinidis: International Hellenic Univ. (IHU), Greece
Pankaj Kumar: Central Univ. of Himachal Pradesh , India
Aparna Kumari: Nirma Univ., India
Pascal Lorenz: Univ. of Haute Alsace, France
Imad Mahgoub: Florida Atlantic Univ., USA

Farid Nait-Abdesselam: Univ.é Paris Cité, France
Zhaolong Ning: Chongqing Univ. of Posts and Telecommunications, China
Jun Peng: UTRGV - Edinburg, TX, USA
Joel Rodrigues: Senac Fac of Ceará, Brazil
Angel Antonio San-Blas: Univ. of Elche, Spain
Georgios L. Stavrinides: KIOS CoE, Univ. of Cyprus, Cyprus
Tala Talaei Khoei: Northeastern Univ., USA
Eleftherios Tiakas: International Hellenic Univ., Greece
George Tsihrintzis: Univ. of Piraeus, Greece
Anastasios Valkanis: Aristotle Univ. of Thessaloniki, Greece
Gang Wang: MaxLinear Inc., USA
Cong Wu: The Univ. of Hong Kong, Hong Kong
Laurence T. Yang, St. Francis Xavier Univ.: Canada ,
Sherali Zeadally: Univ. of Kentucky, USA
Xinyu Zhang: Northwestern Polytechnical Univ., China

Technical Sponsor

Important Dates

Participation

Paper Submission

Important Notice